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High-Performance Power ICs and Hall-Effect Sensors
Semiconductor
Package Information
General Package Information (PDF)
- Package Designations
- Package Thermal Characteristics
- Package Mechanical Characteristics
- Plastic Dual In-Line (DIP): Package Designators A, B, and M
- Plastic Leaded Chip
Carrier (PLCC/PQCC): Package Designators EA, EB, ED, EP, EQ
Plastic Low-Profile Quad Flatpack (LQFP): Package Designator JP
Plastic Thin Profile Quad Flatpack (TQFP): Package Designators JS and JU - Plastic Single In-Line (SIP): Package Designators K, KA, KB, KN, KT, U, UA
- Plastic Small Outline Package (SOIC): L, LB, LC, LJ, and LW
- Plastic Small Outline Packages (MSOP, QSOP, and SOT): Package Designators LF, LH, LQ, LT, and LZ
- Plastic Thin Shrink Small Outline Package (TSSOP): LD, LE, LG, and LP
- Power Multi-Chip Modules (PMCM™)
- Sensor Module: Package Designators CA, CB, SA, SB, SE, SG, SH, SJ
Application Notes (PDF)
- Soldering Methods for Allegro's Products — SMD and Through-Hole
- Guidelines for Designing Subassemblies Using Hall-Effect Devices
- Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages